Processing In the semiconductor manufacturing process, wafer thinning is a critical post-packaging procedure that requires accurately reducing the wafer thickness from several hundred micrometers to tens of micrometers. This places extreme demands on the precision, stability, and anti-interference capability of the equipment’s core components. The spindle rotation unit and worktable drive system of the wafer thinning machine serve as the core executive mechanisms; their performance directly determines the thickness uniformity, surface finish, and yield rate of the thinned wafer — and specialized precision bearings are the "core joints" that ensure the stable operation of these two units.
New Bee Transmission has custom-developed the KG200X and KG350X series of specialized bearings for the harsh operating conditions of semiconductor wafer thinning machines. By optimizing the structural design and material technology, these bearings perfectly meet the core requirements of "high precision, low vibration, corrosion resistance, and long-term reliability" during the thinning process, providing reliable support for the efficient and stable operation of wafer thinning machines.
1. Ultra-High Rotational Precision: Ensuring Thickness Uniformity of Thinned Wafers Wafer thinning requires ±1μm-level thickness control. The KG200X/KG350X bearings meet this precision requirement through the following designs:
Adopt P0-level high-precision manufacturing standards, with rotational radial runout ≤ 5μm, ensuring no deflection during the operation of the thinning machine’s spindle or worktable;
Integrally formed raceway with precision grinding technology reduces the movement trajectory deviation of rollers, avoiding local over-thinning of the wafer or uneven residual thickness caused by insufficient bearing precision.
2. High Rigidity and Low Vibration: Safeguarding the Processing of Ultra-Thin Wafers Thinned wafers (thickness ≤ 50μm) are prone to cracking due to vibration. The KG200X/KG350X bearings enhance vibration resistance through structural optimization:
Optimized interference fit tolerance with the thinning machine's spindle reduces rigidity loss caused by assembly gaps, ensuring stable transmission of cutting force.
3.Excellent Corrosion Resistance: Adapting to the Coolant Environment of Thinning Machines During the wafer thinning process, coolant (such as ethylene glycol solution) must be continuously sprayed for cooling and chip removal. The KG200X/KG350X bearings achieve corrosion resistance through material upgrades:
The cage is made of brass, avoiding aging and deformation caused by coolant immersion, and is suitable for a coolant temperature range of 5-40°C.
4. Long-Term Stable Operation: Reducing Downtime Costs of Semiconductor Production Lines Semiconductor production lines pursue "24/7 continuous production." The KG200X/KG350X bearings reduce maintenance frequency through long-life design:
Adopt Krytox perfluoropolyether long-life grease, which has a lubrication life of up to 8,000 hours in vacuum or clean environments — twice that of ordinary grease;
Optimized roller contact stress distribution increases the basic dynamic load rating by 15%, reducing the risk of fatigue failure;
Meet the requirements of thinning machine cleanrooms (Class 1000), with a bearing surface roughness of Ra ≤ 0.5μm and no dust shedding, complying with semiconductor industry cleanliness standards.
Parameter | KG200X Specification | KG350X Specification |
Bearing Type | Specialized Precision Roller Bearing for Wafer Thinning Machines | Specialized Precision Roller Bearing for Wafer Thinning Machines |
Inner Diameter (d) | 508mm | 558.8mm |
Outer Diameter (D) | 889mm | 939.8mm |
Cross-Section Height (B) | 25.4mm | 25.4mm |
Precision Class | P0 | P0 |
Applicable Coolant Type | Ethylene glycol and deionized water mixture | Ethylene glycol and deionized water mixture |
Applicable Wafer Size | 8-12 inches | 12-18 inches |
1. Yield Rate Improvement: The ultra-high precision and low vibration characteristics of the bearings control the thickness tolerance of thinned wafers within ±0.5μm, increasing the yield rate from 92% to over 98%;
2.Extended Maintenance Cycle: The corrosion resistance and long-life lubrication design extend the bearing maintenance interval of thinning machines from 3 months to 12 months, reducing downtime by 70%;
3. Adaptation to Multi-Specification Requirements: The KG200X is suitable for 8-12 inch small-to-medium size wafer thinning machines, while the KG350X is suitable for 12-18 inch large size wafer thinning machines, covering mainstream semiconductor wafer specifications;
4.Energy Consumption Reduction: The low friction coefficient design reduces the energy consumption of the thinning machine’s spindle drive by 8-10%, meeting the energy-saving needs of the semiconductor industry.
1. In-Depth Adaptation Experience in the Semiconductor Industry
With over 10 years of experience in the semiconductor equipment bearing field, we have participated in the equipment development of many leading thinning machine manufacturers and have a deep understanding of the special requirements of wafer thinning processes for bearings;
The bearing design complies with SEMI S2/S8 semiconductor equipment safety standards and has passed ISO 14644-1 Class 5 cleanroom certification, enabling direct use in semiconductor clean production lines.
2. Full-Process Quality Control
Raw materials use SGS-certified AISI 52100 bearing steel to eliminate the impact of impurities;
Every set of KG200X/KG350X bearings undergoes 100% rotational precision testing, corrosion testing, and vibration testing before leaving the factory.
3. Customization and Technical Support
Can adjust the bearing’s sealing structure, grease type, or installation dimensions according to the special needs of thinning machine manufacturers;
Provide bearing installation guidance, life prediction, and fault diagnosis services to help customers optimize equipment operation and maintenance plans.
Contact Us: Obtain Wafer Thin Bearing Solutions
For detailed technical specifications, sample testing, or custom solutions of KG200X/KG350X bearings, please contact us via the following methods:
Email: paul@newbeetrans.com
Phone: +86 15122832049
Official Website: www.newbeetrans.com